Markets & Applications

Technologies & Solutions

Technologies

• Base Packaging Technologies
• SPRiNG Technology
• SKiiP Technology
• Single Sided Sintering
• Double Sided Sintering
• Direct Pressed Die Technology
• Bond Buffer
• Shower Power
• Transfer Molding

Technological Trends

• Silicon Carbide Power Modules
• Higher Operating Voltage
• Thermal Interface Materials

Service & Support

Download Center

Application Support

• Application Manual
• SemiSel Simulation

Sales Support

• E-Commerce
• Complaints & Returns
• Material Number look-up tool

Supplier Support

About Semikron Danfoss

Company

• Executive Management
• Global Footprint
• Leadership Team

Ethics & Compliance

• Corporate Social Responsibility
• Product Material Compliance
• Trade Compliance
• Whistle-Blowing System

Our ESG Ambition

News & Events

• News
  • Innovation & Young Engineer Awards: Call for Proposals
  • New President
  • Systems Optimized for ESS Applications
  • SiC Power Modules for SMA Residential Inverters
  • Cooperation for MiniSKiiP Packaging Technology
  • Partnership with SUNY Poly
  • IPCEI projects by the EU Commission
  • Agreement for Electromobility Chips
  • ROHM IGBTs for True Multiple Sourcing
  • Dana selects eMPack for SiC Inverter Development
  • Approved: Green light for joined company Semikron Danfoss
• Trade Fairs & Events
• Technical Webinars

Career

Who We Are

Who We Are Looking For

• Experienced Professionals
• Students & Graduates
• Ausbildung
  • Technische Berufe
  • IT Berufe
  • Kaufmännische Berufe

Career Contact

• Bewerbungsprozess

Contact