24914740VM01
SK 30 GBB 066 T-M01
SEMITOP 3, Wacker P12
24914740VM01
Product specifications
Characteristic | Value |
|---|---|
| Current (A) | 30 A |
| Voltage (V) | 600 V |
| Topology | H-Bridge |
| Housing | SEMITOP 3 |
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Italy |
| Dimensions (LxWxH) | 55x31x12 |
| Features | Compact designOne scre mountingHeat transfer and isolation trough direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL HD technology FWDIntegrated NTC temperature sensor |
| Product line | SEMITOP |
| Product Status | In Production |
| Technology | IGBT |
| Typical applications | Switching (not for linear use)InverterSwitched mode power suppliesUPS |
| Variant | Wacker P12 |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.039 Kilogram |
| Net weight | 0.03 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |
Variant information
Characteristic | Value |
|---|---|
| Variant Description | The SK 30 GBB 066 T-M01 is a 600 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation. |
| Variant Short Description | Module + Thermal Paste Wacker P12 |
| Variants | <a href="/products/p/sk-30-gbb-066-t-m01-24914740vm01">SK 30 GBB 066 T-M01</a><a href="/products/p/sk-30-gbb-066-t-m05-24914740vm05">SK 30 GBB 066 T-M05</a> |