25231360M25
SKiiP 39AC066V4-M25
MiniSKiiP II 3, Standard lid and HPTP
25231360M25
Product specifications
Characteristic | Value |
|---|---|
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Germany |
| Current (A) | 150 A |
| Dimensions (LxWxH) | 82x59x16 |
| Features | Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532 |
| Housing | MiniSKiiP II 3 |
| Product line | MiniSKiiP |
| Product Status | In Production |
| Technology | IGBT |
| Topology | Sixpack |
| Type | MiniSKiiP II 3 |
| Variant | Standard lid and HPTP |
| Variant Description | The SKiiP 39AC066V4-M25 is a 600 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP) |
| Voltage (V) | 600 V |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.1 Kilogram |
| Net weight | 0.082 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |