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24923021VM05

SK25GD12F4ETp-M05

SEMITOP 3, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originItaly
Current (A)25 A
Voltage (V)1200 V
TopologySixpack
Product lineSEMITOP
HousingSEMITOP 3
Dimensions (LxWxH)31x55x12
TechnologyIGBT
Chip technologyIGBT 4 Fast (Trench)
FeaturesOne screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesTrench4 IGBT technologyCAL4F technology FWDIntegrated NTC temperature sensorUL recognized, file no. E 63 532
Typical applicationsMotor drivesServo drivesAir conditioningAuxiliary InvertersUPS

General specifications

Characteristic
Value
Gross weight0.035 Kilogram
Net weight0.026 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantHPTP
Variant DescriptionThe SK25GD12F4ETp-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk25gd12f4etp-m05-24923021vm05">SK25GD12F4ETp-M05</a><a href="/products/p/sk25gd12f4etp-24923021">SK25GD12F4ETp</a>