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27922900VM05

SEMiX305MLI12E4V2-M05

SEMiX 5p, HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 4 (Trench)
Country of originItaly
Current (A)300 A
Dimensions (LxWxH)130x70x17
FeaturesSolderless assembling solution with PressFIT signal pins and screw power terminalsIGBT 4 Trench Gate TechnologyV<sub>CE(sat) </sub>with positive temperature coefficientLow inductance caseReliable mechanical design with injection moulded terminals and reliable internal connectionsUL recognized file no. E63532NTC temperature sensor inside
HousingSEMiX 5p
Product lineSEMiX
Product StatusIn Production New
TechnologyIGBT
Topology3-Level
TypeSEMiX 5p
Typical applicationsSolar, Power Supply
VariantHPTP
Variant DescriptionThe SEMiX305MLI12E4V2-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.475 Kilogram
Net weight0.39 Kilogram
Proposition 65Cancer and Reproductive Harm