PCIM Asia Shanghai 2025

PCIM Asia Shanghai is the sister event of PCIM Expo & Conference and opens its gates in China to all experts in the world of power electronics. The pairing of first hand know-how and networking across the different industries creates the perfect environment for technologies, innovations and developments. And of course Semikron Danfoss is also there!

Join us at PCIM Asia Shanghai from September 24 - 26 at booth N5 D42, to discover our latest technologies and product innovations. We look forward to welcoming you and showcasing how our solutions are shaping the future of power electronics.

Visit us at PCIM Asia
Shanghai 2025, Booth N5 D42

Remaining the leading international exhibition for power electronics, intelligent motion, renewable energy, and energy management, PCIM has been the meeting place for the power electronics sector for many years. The accompanying Conference is the unique connection of industry and science.

PCIM Asia Shanghai Highlights

With our innovative solutions for automotive, industrial and renewable applications we help the world utilize energy more efficiently and sustainable and thus to significantly reduce overall CO2 emissions – one of the biggest challenges the world faces today. Here is a first look at some of the highlights we will be showing at PCIM Asia Shanghai 2025.

50 years of SEMIPACK^®

When first released, the SEMIPACK set a new industry standard for power semiconductor modules. It was the first fully isolated power module available on the market and it was the basis for many innovations to come.

eMPack^® M

The Future of High-Performance Power Modules. As electric mobility continues to advance, the need for high-performance power modules becomes increasingly important. The eMPack M provides exceptional power density and efficiency in an ultra-compact design.

It´s your choice

Semikron Danfoss introduces a range of power modules and IPMs, equipped with the latest 2kV SiC technology. The SEMITOP E2, SEMITRANS 3, and SEMITRANS 20 enable flexible converter development. The SKiiP 4 SiC integrates power modules, driver, current sensors and heatsink in a single, high-power unit.

Whether you prefer a standard package or a ready-to-use solution, it’s your choice.

Fully Updated for Today’s Practice

With over 500 pages, our third revised Application Manual Power Semiconductors explains semiconductor fundamentals alongside advanced power module packaging and reliability topics. It provides detailed background information about datasheet statements, their meaning and how they were created. It highlights how innovations in materials and design translate into better products for more efficient, durable, and application-specific solutions.

Stage Presentations

Join Semikron Danfoss at PCIM Asia Shanghai 2025 for a series of expert-led presentations covering the latest innovations in power electronics. Our specialists will share insights into key topics including silicon carbide (SiC) technologies, advanced packaging solutions, reliability improvements, and next-generation inverter designs. These sessions will highlight cutting-edge developments that drive efficiency, performance, and sustainability across multiple applications.