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Semikron Danfoss Standard Photo MiniSKiiP II 2

25233330M15

SKiiP 25AC12RAV1-M15

MiniSKiiP II 2, Slim lid and HPTP

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originGermany
Current (A)50 A
Voltage (V)1200 V
TopologySixpack
Product lineMiniSKiiP
HousingMiniSKiiP II 2
Dimensions (LxWxH)59x52x16
TechnologyIGBT
Chip technologyRGA
Features1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

General specifications

Characteristic
Value
Gross weight0.07 Kilogram
Net weight0.065 Kilogram

Variant information

Characteristic
Value
VariantSlim lid and HPTP
Variant DescriptionThe SKiiP 25AC12RAV1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-25ac12rav1-m01-25233330m01">SKiiP 25AC12RAV1-M01</a><a href="/products/p/skiip-25ac12rav1-m15-25233330m15">SKiiP 25AC12RAV1-M15</a><a href="/products/p/skiip-25ac12rav1-m20-25233330m20">SKiiP 25AC12RAV1-M20</a><a href="/products/p/skiip-25ac12rav1-m25-25233330m25">SKiiP 25AC12RAV1-M25</a>