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Semikron Danfoss Standard Photo MiniSKiiP II 2

25233330M15

SKiiP 25AC12RAV1-M15

MiniSKiiP II 2, Slim lid and HPTP

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Product specifications

Characteristic
Value
Current (A)50 A
Voltage (V)1200 V
TopologySixpack
HousingMiniSKiiP II 2
Chip technologyRGA
Country of originGermany
Dimensions (LxWxH)59x52x16
Features1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
Product lineMiniSKiiP
Product StatusIn Production New
TechnologyIGBT
VariantSlim lid and HPTP

General specifications

Characteristic
Value
Gross weight0.07 Kilogram
Net weight0.065 Kilogram

Variant information

Characteristic
Value
Variant DescriptionThe SKiiP 25AC12RAV1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-25ac12rav1-m01-25233330m01">SKiiP 25AC12RAV1-M01</a><a href="/products/p/skiip-25ac12rav1-m15-25233330m15">SKiiP 25AC12RAV1-M15</a><a href="/products/p/skiip-25ac12rav1-m20-25233330m20">SKiiP 25AC12RAV1-M20</a><a href="/products/p/skiip-25ac12rav1-m25-25233330m25">SKiiP 25AC12RAV1-M25</a>