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23918900VM05

SKiM601MLI07E4-M05

SKiM 4, HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 3 (Trench)
Country of originItaly
Current (A)600 A
Dimensions (LxWxH)123x107x35
FeaturesIGBT 4 Trench Gate TechnologySolder technologyV<sub>CE(sat)</sub> with positive temperature coefficientLow inductance caseIsolated by Al<sub>2</sub>O<sub>3</sub> DCB (Direct Copper Bonded) ceramic substratePressure contact technology for thermal contactsSpring contact system to attach driver PCB to the control terminalsHigh short circuit capability, self limiting to 6 x I<sub>C</sub>Integrated temperature sensor
HousingSKiM 4
Product lineSKiM 4/5
Product StatusIn Production
TechnologyIGBT
Topology3-Level
TypeSKiM 4
Typical applicationsUPS3 Level Inverter
VariantHPTP
Variant DescriptionThe SKiM601MLI07E4-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Voltage (V)650 V

General specifications

Characteristic
Value
Gross weight0.426 Kilogram
Net weight0.295 Kilogram
Proposition 65Cancer and Reproductive Harm