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24922720VM05

SK20DGDL07E3ETE1-M05

SEMITOP E1, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production
Country of originItaly
Current (A)20 A
Voltage (V)650 V
TopologyCIB
Product lineSEMITOP
HousingSEMITOP E1
Dimensions (LxWxH)63x34x12
TechnologyIGBT
Chip technologyIGBT 3 (Trench)
FeaturesOptimized design for superior thermal performanceLow inductive designPress-Fit contact technology650V Trench IGBT3 (E3)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typical applicationsMotor drivesAir conditioningAuxiliary Inverters

General specifications

Characteristic
Value
Gross weight0.022 Kilogram
Net weight0.022 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantHPTP
Variant DescriptionThe SK20DGDL07E3ETE1-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk20dgdl07e3ete1-m05-24922720vm05">SK20DGDL07E3ETE1-M05</a>