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SEMiX®3p+

SEMiX 3p+ builds on the proven success of the SEMiX 3 Press-Fit platform, combining a compact 17 mm package height, solder-free driver connectivity, and enhanced power density in a versatile medium-power module solution.

Efficient by Design, Scaled for Growth

Designed for modern industrial converters, SEMiX 3p+ delivers improved electrical and thermal performance while preserving the simplicity and scalability that have made the SEMiX platform a benchmark across motor drives, renewable energy systems, UPS solutions, and power supplies. The result is a future-ready platform that supports higher efficiency, simplified assembly, and streamlined converter design.

Built for the demands of modern energy conversion

SEMiX 3p+ combines separated AC and DC power terminals with a low-profile 17 mm package, enabling highly compact inverter layouts and optimized busbar designs. The platform supports direct gate driver mounting on the power module, reducing interconnect complexity while improving electromagnetic performance.

Its standardized mechanical design allows manufacturers to scale power levels across multiple converter platforms while minimizing redesign effort.

Key benefits include:

  • Increased operating temperature, Tj,op = 175°C
  • Welded power terminals
  • Extended power range up to ICnom = 900A
  • Humidity robustness
  • Direct driver mounting capability
  • Features our new CAL7 diodes

Press-Fit Technology

At the heart of SEMiX 3p+ is proven Press-Fit technology for auxiliary connections. Unlike traditional soldered driver interfaces, Press-Fit pins create highly reliable electrical connections while eliminating soldering processes from production.

Benefits of Press-Fit Connectivity:

  • Solder-free assembly
  • Faster production processes
  • Improved connection reliability
  • Enhanced mechanical robustness
  • Simplified service and maintenance

Flexible Semiconductor Platform

SEMiX 3p+ supports a broad range of semiconductor chip technologies and topologies, enabling designers to optimize performance for different power conversion requirements. Available configurations include various voltage classes and current ratings across industrial applications.

Supported Configurations:

  • Half-bridge
  • Chopper
  • Boost
  • Buck
  • Common emitter
  • Rectifier modules

Typical Applications

SEMiX 3p+ Typical Applications

SEMiX 3p+ is ideal for medium-power industrial converters including:

  • Wind energy converters
  • Energy storage systems
  • Industrial power supplies
  • Industrial motor drives

Portfolio

Type DesignationVces in VInom in ATopology
SEMiX453GB12E7p1200450Half-bridge
SEMiX603GB12E7p1200600Half-bridge
SEMiX603GB12E7Dp1200600Half-bridge (with 750A diode)
SEMiX753GB12E7p1200750Half-bridge
SEMiX753GB12E7Dp1200750Half-bridge (with 900A diode)
SEMiX903GB12E7p1200900Half-bridge
SEMiX453GB17C7p1700 450Half-bridge
SEMiX603GB17C7p1700 600Half-bridge
SEMiX903GB17C7p1700 900Half-bridge

 

At a Glance

SEMiX 3p+ delivers the perfect combination of compact design, press-fit reliability, thermal performance, and scalable power conversion capability. By reducing assembly complexity while improving system integration, it provides an ideal platform for the next generation of industrial power electronics.

  • Industry-standard medium-power module platform
  • Press-Fit auxiliary connections
  • Optimized for direct driver mounting
  • Improved thermal performance
  • Broad portfolio of topologies and voltage classes, using multiple chip suppliers