SEMiX®3p+
SEMiX 3p+ builds on the proven success of the SEMiX 3 Press-Fit platform, combining a compact 17 mm package height, solder-free driver connectivity, and enhanced power density in a versatile medium-power module solution.
Built for the demands of modern energy conversion
SEMiX 3p+ combines separated AC and DC power terminals with a low-profile 17 mm package, enabling highly compact inverter layouts and optimized busbar designs. The platform supports direct gate driver mounting on the power module, reducing interconnect complexity while improving electromagnetic performance.
Its standardized mechanical design allows manufacturers to scale power levels across multiple converter platforms while minimizing redesign effort.
Key benefits include:
- Increased operating temperature, Tj,op = 175°C
- Welded power terminals
- Extended power range up to ICnom = 900A
- Humidity robustness
- Direct driver mounting capability
- Features our new CAL7 diodes
Press-Fit Technology
At the heart of SEMiX 3p+ is proven Press-Fit technology for auxiliary connections. Unlike traditional soldered driver interfaces, Press-Fit pins create highly reliable electrical connections while eliminating soldering processes from production.
Benefits of Press-Fit Connectivity:
- Solder-free assembly
- Faster production processes
- Improved connection reliability
- Enhanced mechanical robustness
- Simplified service and maintenance
Flexible Semiconductor Platform
SEMiX 3p+ supports a broad range of semiconductor chip technologies and topologies, enabling designers to optimize performance for different power conversion requirements. Available configurations include various voltage classes and current ratings across industrial applications.
Supported Configurations:
- Half-bridge
- Chopper
- Boost
- Buck
- Common emitter
- Rectifier modules
Typical Applications

SEMiX 3p+ is ideal for medium-power industrial converters including:
- Wind energy converters
- Energy storage systems
- Industrial power supplies
- Industrial motor drives
Portfolio
| Type Designation | Vces in V | Inom in A | Topology |
| SEMiX453GB12E7p | 1200 | 450 | Half-bridge |
| SEMiX603GB12E7p | 1200 | 600 | Half-bridge |
| SEMiX603GB12E7Dp | 1200 | 600 | Half-bridge (with 750A diode) |
| SEMiX753GB12E7p | 1200 | 750 | Half-bridge |
| SEMiX753GB12E7Dp | 1200 | 750 | Half-bridge (with 900A diode) |
| SEMiX903GB12E7p | 1200 | 900 | Half-bridge |
| SEMiX453GB17C7p | 1700 | 450 | Half-bridge |
| SEMiX603GB17C7p | 1700 | 600 | Half-bridge |
| SEMiX903GB17C7p | 1700 | 900 | Half-bridge |
At a Glance
SEMiX 3p+ delivers the perfect combination of compact design, press-fit reliability, thermal performance, and scalable power conversion capability. By reducing assembly complexity while improving system integration, it provides an ideal platform for the next generation of industrial power electronics.
- Industry-standard medium-power module platform
- Press-Fit auxiliary connections
- Optimized for direct driver mounting
- Improved thermal performance
- Broad portfolio of topologies and voltage classes, using multiple chip suppliers