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25241719M21

SKiiP 38GB17E4V1-M21

MiniSKiiP II 3, Standard lid and Wacker P12

Product specifications

Characteristic
Value
Chip technologyIGBT 3 (Trench)
Country of originGermany
Current (A)300 A
Dimensions (LxWxH)82x59x16
FeaturesTrench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
HousingMiniSKiiP II 3
Product lineMiniSKiiP
Product StatusIn Production New
TechnologyIGBT
TopologyHalf-Bridge
TypeMiniSKiiP II 3
VariantStandard lid and Wacker P12
Variant DescriptionThe SKiiP 38GB17E4V1-M21 is a 1700 V IGBT module and comes with a standard 6.5mm height lid and pre-applied silicone-based thermal paste Wacker P12 (λ=0.8 W/mK).
Variant Short DescriptionModule + Standard Pressure Lid + Thermal Paste Wacker P12
Voltage (V)1700 V

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm