Technologies
Power semiconductor packaging is one of Semikron Danfoss’ core competencies. Since the invention of the world’s first electrically isolated power semiconductor module – SEMIPACK – in 1975, our portfolio of technologies has grown considerably. Our innovations in die attach, layout, housing design, and cooling further advance reliability and efficiency in power electronic systems.
Base Packaging Technologies
The majority of industrial power modules utilize proven, cost-effective, solder and wire bond connections for die attach. Semikron Danfoss has decades of experience in reliably implementing these technologies at scale.
SPRiNG Technology
SPRiNG Technology establishes a robust electrical connection between power modules and circuit boards without screws, solder, or press-fit contacts. First deployed in the 1990s, SPRiNG Technology has grown to cover multiple product lines and applications. With decades of field operation and tens of millions of modules in operation, the technology has proven to be exceptionably reliable.
SKiiP Technology
SKiiP Technology is responsible for the original baseplate-less power semiconductor module, employing a direct pressure system to make thermal contact to the heatsink. The lack of baseplate and associated solder means that the assembly is highly resilient to temperature changes and power cycling.
Single Sided Sintering
The solder layer connecting the backside of a chip to the substrate has traditionally been a weak point, particularly for power cycling. By replacing this solder layer with a layer of silver, Single Sided Sintering Technology has dramatically increased the power cycling lifetime of power modules.
Double Sided Sintering
The traditional weak points in power semiconductor chips are the frontside and backside connections. Double Sided Sintering Technology addresses this by completely removing both solder and bond wires for outstanding reliability.
Direct Pressed Die
With the removal of bond wires enabled by Double Sided Sintering Technology, the frontside of the chip is now available. Direct Pressed Die Technology takes full advantage of this real estate by implementing a pressure system to dramatically improve thermal performance.
Bond Buffer
Bond Buffer is a breakthrough in current aluminum-based bonding and joining technology. With copper layer on the semiconductor, sintering and copper bond wire, Bond Buffer usher in the new era in module packaging.
Shower Power
Shower Power is a unique concept for direct liquid cooling of power modules. The patented technology offers superior thermal performance at a very low cost. Shower Power utilizes several meandering cooling channels to guide the coolant along the baseplate. This design improves thermal performance by creating a swirl effect in the cooling channels. This means that the coolant is constantly brought into contact with the surface that requires cooling.
Transfer Molding
Electric drivetrains operating in demanding conditions benefit from our unique transfer molded packaging design. Sealed and protected against vibrations and humidity, the inverter design benefits from highest package stability and reliability. Transfer Molding in combination with our Bond Buffer Technology allows for more extreme temperature cycling and higher junction temperatures to increase power density.