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25232420M25

SKiiP 01NEC066V3-M25

MiniSKiiP II 0, Standard lid and HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 3 (Trench)
Country of originGermany
Current (A)6 A
Dimensions (LxWxH)34x31x16
FeaturesTrench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
HousingMiniSKiiP II 0
Product lineMiniSKiiP
Product StatusIn Production
TechnologyIGBT
TopologyCI
TypeMiniSKiiP II 0
Typical applicationsInverter up to 3,5 kVATypical motor power 1,5 kW
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 01NEC066V3-M25 is a 600 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Voltage (V)600 V

General specifications

Characteristic
Value
Gross weight0.023 Kilogram
Net weight0.02 Kilogram
Proposition 65Cancer and Reproductive Harm