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Semikron Danfoss Standard Photo MiniSKiiP II 3

25232780M25

SKiiP 39TMLI12T4V2-M25

MiniSKiiP II 3, Standard lid and HPTP

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Product specifications

Characteristic
Value
Current (A)200 A
Voltage (V)1200 V
Topology3-Level
HousingMiniSKiiP II 3
Chip technologyIGBT 4 (Trench)
Country of originGermany
Dimensions (LxWxH)82x59x16
FeaturesRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532
Product lineMiniSKiiP
Product StatusIn Production New
TechnologyIGBT
VariantStandard lid and HPTP

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
Variant DescriptionThe SKiiP 39TMLI12T4V2-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-39tmli12t4v2-m00-25232780m00">SKiiP 39TMLI12T4V2-M00</a><a href="/products/p/skiip-39tmli12t4v2-m20-25232780m20">SKiiP 39TMLI12T4V2-M20</a><a href="/products/p/skiip-39tmli12t4v2-m21-25232780m21">SKiiP 39TMLI12T4V2-M21</a><a href="/products/p/skiip-39tmli12t4v2-m25-25232780m25">SKiiP 39TMLI12T4V2-M25</a>