24921130VM05
SK50DGDL066ETE2-M05
SEMITOP E2, HPTP
24921130VM05
Product specifications
Characteristic | Value |
|---|---|
| Current (A) | 50 A |
| Voltage (V) | 600 V |
| Topology | CIB |
| Housing | SEMITOP E2 |
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Italy |
| Dimensions (LxWxH) | 63x57x12 |
| Features | Optimized design for superior thermal performanceLow inductive designPress-Fit contact technology600V Trench IGBT3 (066)Robust and soft switching CAL HD diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532 |
| Product line | SEMITOP |
| Product Status | Sample Status |
| Technology | IGBT |
| Typical applications | Motor drivesAir conditioningAuxiliary Inverters |
| Variant | HPTP |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.055 Kilogram |
| Net weight | 0.035 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |
Variant information
Characteristic | Value |
|---|---|
| Variant Description | The SK50DGDL066ETE2-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + High Performance Thermal Paste (HPTP) |
| Variants | <a href="/products/p/sk50dgdl066ete2-m05-24921130vm05">SK50DGDL066ETE2-M05</a><a href="/products/p/sk50dgdl066ete2-m07-24921130vm07">SK50DGDL066ETE2-M07</a> |