Technological Trends
Technological innovations in individual power electronics applications can quickly become mainstream. Semikron Danfoss is always researching these trends and implementing the highest performing ones into power modules.
Silicon Carbide Power Modules
Silicon carbide is quickly proving to be the premier wide bandgap semiconductor for high power applications. With incredibly low switching losses and the benefits of a MOSFET, SiC power modules have been adopted in solar inverters, UPS systems, and motor drives.
Thermal Interface Materials
Semikron Danfoss was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material (TIM). We now have over two decades of experience and more than 30 million pre-printed modules in the field.
Higher Operating Voltage
Increasing operating voltage is a known technique to reduce current and the associated conduction losses. New power modules equipped with advanced chipsets and topologies allow efficient switching at high DC voltage.
Packaging Evolution
New power semiconductor technologies don’t always require a completely new power module. Improvements can be implemented in time-tested packages. This allows designers to improve the performance of their products without major redesign.