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Semikron Danfoss Standard Photo MiniSKiiP II 3

25232770M21

SKiiP 39GA12T4V1-M21

MiniSKiiP II 3, Standard lid and Wacker P12

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originChinaGermany
Current (A)150 A
Voltage (V)1200 V
TopologySingle Switch
Product lineMiniSKiiP
HousingMiniSKiiP II 3
Dimensions (LxWxH)82x59x16
TechnologyIGBT
Chip technologyIGBT 4 (Trench)
FeaturesTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantStandard lid and Wacker P12
Variant DescriptionThe SKiiP 39GA12T4V1-M21 is a 1200 V IGBT module and comes with a standard 6.5mm height lid and pre-applied silicone-based thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness
Variant Short DescriptionModule + Standard Pressure Lid + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-39ga12t4v1-m00-25232770m00">SKiiP 39GA12T4V1-M00</a><a href="/products/p/skiip-39ga12t4v1-m01-25232770m01">SKiiP 39GA12T4V1-M01</a><a href="/products/p/skiip-39ga12t4v1-m20-25232770m20">SKiiP 39GA12T4V1-M20</a><a href="/products/p/skiip-39ga12t4v1-m21-25232770m21">SKiiP 39GA12T4V1-M21</a><a href="/products/p/skiip-39ga12t4v1-m25-25232770m25">SKiiP 39GA12T4V1-M25</a>