
25232410M25
SKiiP03NEC066V3-M25
MiniSKiiP II 0, Standard lid and HPTP
25232410M25
Product specifications
Characteristic | Value |
|---|---|
| Product Status | In Production |
| Country of origin | Germany |
| Current (A) | 15 A |
| Voltage (V) | 600 V |
| Topology | CI |
| Product line | MiniSKiiP |
| Housing | MiniSKiiP II 0 |
| Dimensions (LxWxH) | 34x31x16 |
| Technology | IGBT |
| Chip technology | IGBT 3 (Trench) |
| Features | Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532 |
| Typical applications | Inverter up to 5,6 kVATypical motor power 3,0 kW |
| Variant | Standard lid and HPTP |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.023 Kilogram |
| Net weight | 0.02 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |
Variant information
Characteristic | Value |
|---|---|
| Variant Description | The SKiiP03NEC066V3-M25 is a 600 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP) |
| Variants | <a href="/products/p/skiip03nec066v3-m00-25232410m00">SKiiP03NEC066V3-M00</a><a href="/products/p/skiip03nec066v3-m01-25232410m01">SKiiP03NEC066V3-M01</a><a href="/products/p/skiip03nec066v3-m10-25232410m10">SKiiP03NEC066V3-M10</a><a href="/products/p/skiip03nec066v3-m11-25232410m11">SKiiP03NEC066V3-M11</a><a href="/products/p/skiip03nec066v3-m20-25232410m20">SKiiP03NEC066V3-M20</a><a href="/products/p/skiip03nec066v3-m21-25232410m21">SKiiP03NEC066V3-M21</a><a href="/products/p/skiip03nec066v3-m25-25232410m25">SKiiP03NEC066V3-M25</a> |