Semikron Danfoss logo
Semikron Danfoss Standard Photo MiniSKiiP II 3

25231740M25

SKiiP 35ACC12F4V1-M25

MiniSKiiP II 3, Standard lid and HPTP

*Account required

Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originChinaGermany
Current (A)50 A
Voltage (V)1200 V
TopologyTwelvepack
Product lineMiniSKiiP
HousingMiniSKiiP II 3
Dimensions (LxWxH)82x59x16
TechnologyIGBT
Chip technologyIGBT 4 Fast (Trench)
FeaturesFast Trench 4 IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 35ACC12F4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-35acc12f4v1-m01-25231740m01">SKiiP 35ACC12F4V1-M01</a><a href="/products/p/skiip-35acc12f4v1-m05-25231740m05">SKiiP 35ACC12F4V1-M05</a><a href="/products/p/skiip-35acc12f4v1-m20-25231740m20">SKiiP 35ACC12F4V1-M20</a><a href="/products/p/skiip-35acc12f4v1-m21-25231740m21">SKiiP 35ACC12F4V1-M21</a><a href="/products/p/skiip-35acc12f4v1-m25-25231740m25">SKiiP 35ACC12F4V1-M25</a>