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27892120VM05

SEMiX302GAL17E4s-M05

SEMiX 2s, HPTP

Product specifications

Characteristic
Value
Current (A)300 A
Voltage (V)1700 V
TopologyChopper/Booster
HousingSEMiX 2s
Chip technologyIGBT 4 (Trench)
Country of originSlovakia
Dimensions (LxWxH)117x64x17
FeaturesHomogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityUL recognized, file no. E63532
Product lineSEMiX
Product StatusIn Production
TechnologyIGBT
Typical applicationsAC inverter drivesUPSElectronic Welding
VariantHPTP

General specifications

Characteristic
Value
Gross weight0.279 Kilogram
Net weight0.24 Kilogram

Variant information

Characteristic
Value
Variant DescriptionThe SEMiX302GAL17E4s-M05 is a 1700 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/semix302gal17e4s-m04-27892120vm04">SEMiX302GAL17E4s-M04</a><a href="/products/p/semix302gal17e4s-m05-27892120vm05">SEMiX302GAL17E4s-M05</a><a href="/products/p/semix302gal17e4s-m06-27892120vm06">SEMiX302GAL17E4s-M06</a>