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27892120VM05

SEMiX302GAL17E4s-M05

SEMiX 2s, HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 4 (Trench)
Country of originSlovakia
Current (A)300 A
Dimensions (LxWxH)117x64x17
FeaturesHomogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityUL recognized, file no. E63532
HousingSEMiX 2s
Product lineSEMiX
Product StatusIn Production
TechnologyIGBT
TopologyChopper/Booster
TypeSEMiX 2s
Typical applicationsAC inverter drivesUPSElectronic Welding
VariantHPTP
Variant DescriptionThe SEMiX302GAL17E4s-M05 is a 1700 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Voltage (V)1700 V

General specifications

Characteristic
Value
Gross weight0.279 Kilogram
Net weight0.24 Kilogram