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24921440VM05

SK25GD12T4ETE1-M05

SEMITOP E1, HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 4 (Trench)
Country of originItaly
Current (A)25 A
Dimensions (LxWxH)63x34x12
FeaturesOptimized design for superior thermal performancesLow inductive designPress-Fit contact technology1200V Trench IGBT4 (T4)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
HousingSEMITOP E1
Product lineSEMITOP
Product StatusIn Production
TechnologyIGBT
TopologySixpack
TypeSEMITOP E1
Typical applicationsMotor drivesServo drivesAir conditioningAuxiliary InvertersUPS
VariantHPTP
Variant DescriptionThe SK25GD12T4ETE1-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.022 Kilogram
Net weight0.022 Kilogram
Proposition 65Cancer and Reproductive Harm