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PCIM Asia Shenzhen 2026

PCIM Asia Shenzhen is the sister event of PCIM Expo & Conference and opens its gates in China to all experts in the world of power electronics. The pairing of first hand know-how and networking across the different industries creates the perfect environment for technologies, innovations and developments.

Join us at PCIM Asia Shenzhen from August 26-28, hall 16, booth E16 to discover our latest technologies and product innovations. We look forward to welcoming you and showcasing how our solutions are shaping the future of power electronics.

Visit us at PCIM Asia Shenzhen 2026, Hall 16, Booth E16

Remaining the leading international exhibition for power electronics, intelligent motion, renewable energy, and energy management, PCIM has been the meeting place for the power electronics sector for many years. The accompanying conference is the unique connection of industry and science.

PCIM Asia Shenzhen Highlights

With our innovative solutions for automotive, industrial and renewable applications we help the world utilize energy more efficiently and sustainable and thus to significantly reduce overall CO2 emissions – one of the biggest challenges the world faces today. Here is a first look at some of the highlights we will be showing at PCIM Asia Shenzhen 2026. 

Power Electronics for Data Centers

High-Efficiency Power Modules for the Next Generation of Data Centers

With a strong history of delivering reliable power modules for UPS systems, we are ready for the next evolution of the data center ecosystem.

Today, both small and large data centers rely on Semikron Danfoss power modules inside UPS systems and motor drives for reliable power transfer and cooling. Power modules such as SEMITRANS 3 and SEMiX 5 are core components in 3-level converters used for today’s megawatt-class central UPS systems. 

New Multi-Sourcing Option for IGBTs

Expanded IGBT chip portfolio delivers more choice

Our power modules are available with the latest CRRC IGBT chips, offering blocking voltages of 1200V, 1700V, and 2300V, a maximum operating junction temperature of 175°C, and low conduction and switching losses.

SEMITRANS® 3+

Proven Package, Next-Level Performance
SEMITRANS 3+

Supporting multiple-source IGBT and SiC chipsets, and with a complete internal redesign, the SEMITRANS 3+ pushes multi-level inverter and half bridge circuit configurations to higher power and reliability, while leveraging a trusted, industry-standard package.

Stage Presentations

Join Semikron Danfoss at PCIM Asia Shenzhen 2026 for a series of expert-led presentations covering the latest innovations in power electronics. Our specialists will share insights into key topics including silicon carbide (SiC) technologies, advanced packaging solutions, reliability improvements, and next-generation inverter designs. These sessions will highlight cutting-edge developments that drive efficiency, performance, and sustainability across multiple applications.