Semikron Danfoss logo

24922230VM05

SK25DGDL12T4ETE2V1-M05

SEMITOP E2, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production
Country of originItaly
Current (A)25 A
Voltage (V)1200 V
TopologyCIB
Product lineSEMITOP
HousingSEMITOP E2
Dimensions (LxWxH)63x57x12
TechnologyIGBT
Chip technologyIGBT 4 (Trench)
FeaturesOptimized design for superior thermal performancesLow inductive designPress-Fit contact technology1200V Trench IGBT4 (T4)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typical applicationsMotor drivesAir conditioningAuxiliary Inverters
VariantHPTP
Variant DescriptionThe SK25DGDL12T4ETE2V1-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk25dgdl12t4ete2v1-m05-24922230vm05">SK25DGDL12T4ETE2V1-M05</a><a href="/products/p/sk25dgdl12t4ete2v1-24922230">SK25DGDL12T4ETE2V1</a>

General specifications

Characteristic
Value
Gross weight0.055 Kilogram
Net weight0.035 Kilogram
Proposition 65Cancer and Reproductive Harm