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Semikron Danfoss Standard Photo MiniSKiiP II 3

25240719M11

SKiiP 38GB07E3V1-M11

MiniSKiiP II 3, Slim lid and Wacker P12

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originGermany
Current (A)300 A
Voltage (V)650 V
TopologyHalf-Bridge
Product lineMiniSKiiP
HousingMiniSKiiP II 3
Dimensions (LxWxH)82x59x16
TechnologyIGBT
Chip technologyIGBT 3 (Trench)
Features650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantSlim lid and Wacker P12
Variant DescriptionThe SKiiP 38GB07E3V1-M11 is a 650 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Variant Short DescriptionModule + Slim Pressure Lid + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-38gb07e3v1-m00-25240719m00">SKiiP 38GB07E3V1-M00</a><a href="/products/p/skiip-38gb07e3v1-m01-25240719m01">SKiiP 38GB07E3V1-M01</a><a href="/products/p/skiip-38gb07e3v1-m10-25240719m10">SKiiP 38GB07E3V1-M10</a><a href="/products/p/skiip-38gb07e3v1-m11-25240719m11">SKiiP 38GB07E3V1-M11</a><a href="/products/p/skiip-38gb07e3v1-m20-25240719m20">SKiiP 38GB07E3V1-M20</a><a href="/products/p/skiip-38gb07e3v1-m21-25240719m21">SKiiP 38GB07E3V1-M21</a><a href="/products/p/skiip-38gb07e3v1-m25-25240719m25">SKiiP 38GB07E3V1-M25</a>