24914760VM05
SK 75 GBB 066 T-M05
SEMITOP 3, HPTP
24914760VM05
Product specifications
Characteristic | Value |
|---|---|
| Current (A) | 75 A |
| Voltage (V) | 600 V |
| Topology | H-Bridge |
| Housing | SEMITOP 3 |
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Italy |
| Dimensions (LxWxH) | 55x31x12 |
| Features | Compact designOne scre mountingHeat transfer and isolation trough direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL HD technology FWDIntegrated NTC temperature sensor |
| Product line | SEMITOP |
| Product Status | In Production |
| Technology | IGBT |
| Typical applications | Switching (not for linear use)InverterSwitched mode power suppliesUPS |
| Variant | HPTP |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.039 Kilogram |
| Net weight | 0.03 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |
Variant information
Characteristic | Value |
|---|---|
| Variant Description | The SK 75 GBB 066 T-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + High Performance Thermal Paste (HPTP) |
| Variants | <a href="/products/p/sk-75-gbb-066-t-m05-24914760vm05">SK 75 GBB 066 T-M05</a> |