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25241221M15

SKiiP 39GB12E4V1-M15

MiniSKiiP II 3, Slim lid and HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 4 (Trench)
Country of originGermany
Current (A)400 A
Dimensions (LxWxH)82x59x16
FeaturesTrench 4 IGBT´sRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized file no. E63532
HousingMiniSKiiP II 3
Product lineMiniSKiiP
Product StatusIn Production New
TechnologyIGBT
TopologyHalf-Bridge
TypeMiniSKiiP II 3
VariantSlim lid and HPTP
Variant DescriptionThe SKiiP 39GB12E4V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.094 Kilogram
Net weight0.076 Kilogram
Proposition 65Cancer and Reproductive Harm