Semikron Danfoss logo
Semikron Danfoss Standard Photo MiniSKiiP II 2 GB

25240715M25

SKiiP 26GB07E3V1-M25

MiniSKiiP II 2, Standard lid and HPTP

*Account required

Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originGermany
Current (A)200 A
Voltage (V)650 V
TopologyHalf-Bridge
Product lineMiniSKiiP
HousingMiniSKiiP II 2
Dimensions (LxWxH)59x52x16
TechnologyIGBT
Chip technologyIGBT 3 (Trench)
Features650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor

General specifications

Characteristic
Value
Gross weight0.06 Kilogram
Net weight0.055 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 26GB07E3V1-M25 is a 650 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-26gb07e3v1-m00-25240715m00">SKiiP 26GB07E3V1-M00</a><a href="/products/p/skiip-26gb07e3v1-m01-25240715m01">SKiiP 26GB07E3V1-M01</a><a href="/products/p/skiip-26gb07e3v1-m10-25240715m10">SKiiP 26GB07E3V1-M10</a><a href="/products/p/skiip-26gb07e3v1-m11-25240715m11">SKiiP 26GB07E3V1-M11</a><a href="/products/p/skiip-26gb07e3v1-m20-25240715m20">SKiiP 26GB07E3V1-M20</a><a href="/products/p/skiip-26gb07e3v1-m21-25240715m21">SKiiP 26GB07E3V1-M21</a><a href="/products/p/skiip-26gb07e3v1-m25-25240715m25">SKiiP 26GB07E3V1-M25</a>