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22896070VM04

SKM300GB12F4-M04

SEMITRANS 3

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Product specifications

Characteristic
Value
Chip technologyIGBT 4 High Speed (Trench)
Current (A)300 A
Dimensions (LxWxH)106x62x31
FeaturesInsulated copper baseplate using DBC technology (Direct Bonded Copper)CAL4 ultra-fast = soft switching 4. generation CAL-diodeHigh speed trench and field-stop IGBTIncreased power cycling capabilityFor higher switching frequencies above 15kHzUL recognized, file no. E63532
HousingSEMITRANS 3
Product StatusIn Production New
Product lineSEMITRANS
TechnologyIGBT
TopologyHalf-Bridge
TypeSEMITRANS 3
Typical applicationsInductive heatingSwitched mode power suppliesElectronic weldersUPS
Voltage (V)1200 V

General specifications

Characteristic
Value
Proposition 65Cancer and Reproductive Harm