25230830M11
SKiiP 11HEB066V1-M11
MiniSKiiP II 1, Slim lid and Wacker P12
25230830M11
Product specifications
Characteristic | Value |
|---|---|
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Germany |
| Current (A) | 15 A |
| Dimensions (LxWxH) | 42x40x16 |
| Features | Trench IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532 |
| Housing | MiniSKiiP II 1 |
| Product line | MiniSKiiP |
| Product Status | In Production |
| Technology | IGBT |
| Topology | CIB |
| Type | MiniSKiiP II 1 |
| Variant | Slim lid and Wacker P12 |
| Variant Description | The SKiiP 11HEB066V1-M11 is a 600 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation. |
| Variant Short Description | Module + Slim Pressure Lid + Thermal Paste Wacker P12 |
| Voltage (V) | 600 V |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.04 Kilogram |
| Net weight | 0.03 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |