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Semikron Danfoss Standard Photo MiniSKiiP II 3

25231160M25

SKiiP 37AC12T7V1-M25

MiniSKiiP II 3, Standard lid and HPTP

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Product specifications

Characteristic
Value
Current (A)75 A
Voltage (V)1200 V
TopologySixpack
HousingMiniSKiiP II 3
Chip technologyIGBT T7
Country of originChinaGermany
Dimensions (LxWxH)82x59x16
Features1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
Product lineMiniSKiiP
Product StatusIn Production New
TechnologyIGBT
VariantStandard lid and HPTP

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
Variant DescriptionThe SKiiP 37AC12T7V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-37ac12t7v1-m01-25231160m01">SKiiP 37AC12T7V1-M01</a><a href="/products/p/skiip-37ac12t7v1-m05-25231160m05">SKiiP 37AC12T7V1-M05</a><a href="/products/p/skiip-37ac12t7v1-m15-25231160m15">SKiiP 37AC12T7V1-M15</a><a href="/products/p/skiip-37ac12t7v1-m20-25231160m20">SKiiP 37AC12T7V1-M20</a><a href="/products/p/skiip-37ac12t7v1-m25-25231160m25">SKiiP 37AC12T7V1-M25</a>