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25232300M25

SKiiP 02NEB066V3-M25

MiniSKiiP II 0, Standard lid and HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 3 (Trench)
Country of originGermany
Current (A)10 A
Dimensions (LxWxH)34x31x16
FeaturesTrench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL reognised file no. E63532
HousingMiniSKiiP II 0
Product lineMiniSKiiP
Product StatusIn Production
TechnologyIGBT
TopologyCIB
TypeMiniSKiiP II 0
Typical applicationsInverter up to 5 kVATypical motor power 2,2 kW
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 02NEB066V3-M25 is a 600 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Voltage (V)600 V

General specifications

Characteristic
Value
Gross weight0.023 Kilogram
Net weight0.02 Kilogram
Proposition 65Cancer and Reproductive Harm