Power Electronics for Wind Turbines
This portfolio includes a wide range of products for wind energy applications, from small to medium power modules for pitch and yaw drives to high power components for multi-megawatt power converters. From individual modules including dedicated drivers to high power SKiiP 4 IPMs and ready-to-use power electronic stacks – Semikron Danfoss has the solution.
The demand for reliable spare parts to ensure continuous energy harvesting until the end of the turbine life is becoming increasingly important. Semikron Danfoss has a broad portfolio of products to ensure reliable operation and maintenance for wind turbine converters.
Our products offer maximum reliability for on- and offshore wind turbines both in industry standard packages and in high power SKiiP 4 IPMs and power electronic stacks.
Operation & Maintenance
Wind Turbine O&M
Today, over 400,000 wind turbines are in operation in the field world-wide. The demand for reliable spare parts to ensure continuous energy harvesting until the end of the turbine life is becoming increasingly important. Semikron Danfoss has a broad portfolio of products to ensure reliable operation and maintenance for wind turbine converters. From individual power modules, IPMs and drivers to dedicated, customized retrofit stacks – Semikron Danfoss has the right solution!
Semikron Danfoss offers a broad portfolio with industry standard power modules such as the SEMITRANS and SEMiX family. It includes SKiiP IPMs with customized coolers to fit into your wind turbine converter. The range is rounded off with highly reliable stacks based on solder-free SKiM 93 modules featuring sintered chips. This technology allows for optimized thermal conductivity from chip to heatsink and runs the chip at about 20°C lower than the OEM stack. Semikron Danfoss also offers newly designed driver boards based on the latest Semikron Danfoss ASIC technology with digital signal transmission and additional protection functions.
Whenever power quality and efficiency are driving factors in power electronics applications, 3-level topologies are the key. This is especially true for renewable energy applications where the combination with the latest Generation 7 IGBTs sets new benchmarks.
SEMITRANS 10 MLI and SEMITRANS 10 P3L enable wind turbine converters to reach voltage ranges up to 1000VAC (1500VDC) in 3-level NPC topology and increase converter efficiency. On top of that, less number of modules are allowed in system under given power when you compare with 3-level topology constructed by standard half-bridge modules. Constraining the long commutation loop to one or two modules makes stray inductance lower than ever in high power application.
Key FeaturesMore about SEMITRANS 10
For ANPC topologies, our new SEMITRANS 20 power module combines lowest stray inductance, highest power density and latest Generation 7 IGBTs to set a new benchmark. Its design, based on standard half-bridge topology,, allows an easy ANPC setup and a low inductance DC-link connection. Combined with sintering technology, power cycling capability is further strengthened, up to 5 times longer lifetime compared to previous generation of soldering technology. This guarantees safe and reliable operation during the overall life cycle. Our experienced engineers will help you with device selection, simulation, and mechanical design under a variety of application scenarios.
Key FeaturesMore about SEMITRANS 20
SEMiX 3 Press-Fit helps you reach the same target with less effort. With a deep understanding of user requirements and rich application experience, we are able to allocate valuable silicon to the right circuit position. The lead types of optimized-diode halfbridge and brake chopper modules are perfect examples of our never-ending innovation.
An optimized chipset allows you to achieve cost-effective solutions. The 1700v/450A diode enhanced version with less material can achieve the same performance as a 600A standard halfbridge on the machine side. The 1700V/450A diode-enhanced version brake chopper application instead of a standard halfbridge gives you a competitive solution. Next generation tailormade SEMiX 3 Press-Fit modules with increased density and higher efficiency features are under development.
It‘s Your Choice:
A flexible, cost-effective solution with the same performance or a standard module.
Key FeaturesMore about SEMIX 3 Press-Fit
IGBT and Rectifier Modules
SEMITOP® E1/E20.4kW up to 55kW
Exceeding the Standard for Superior Performance
MiniSKiiP®0.4kW up to 110kW
Solder-Free Spring Technology for Minimum Assembly Time
SEMiX® 6 Press-Fit15kW up to 75kW
The Complete Press-Fit Standard
SEMiX® 3 Press-Fit55kW up to 1MW
Exceeding the Standard for Superior Performance
SEMITRANS® 10/10+500kW up to 2MW
Robust High Power Module
SEMITRANS® 20500kW up to 2MW
The New Standard in High Power
Intelligent Power Modules – IPMs
For Maximum Reliability
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air or water cooling, also with customized heatsinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
SKiiP 3 has propagated widely through the industrial drive segment. With its sixpack or half-bridge topologies, it covers a current range from 500A up to 2400A.
The SKiiP 4, available in half-bridge topology, has been optimized for highest power cycling requirements and covers the higher power range up to 3600A.
To ensure highest reliability and service life, the power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layer, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.
High Performance Cooling (HPC) technology has been introduced providing approximately 25% more output capability compared to standard water cooling. A double side mounting HPC water cooler is also available and enables an even higher power density.
Key FeaturesMore about SkiiP
Power Electronic Stack Platforms
for Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
Our Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver IGBT- and SiC-based stacks for AC voltages from 380V to 1000V. Our standard stacks cover an output current range from 70A to 1400A. Our new SEMIKUBE MLI brings all benefits of 3-level topologies in an off-the-shelf product. It includes all safety and sensing measures for your fast time-to-market.More about Power Electronic Stacks
In addition to standard stacks, Semikron Danfoss has vast experience in developing customer-specific solutions. Engineers are available in our stack centers around the globe to offer specific solutions by adapting existing platforms or designing customized converters.
Four Key Factors for your successMore about Customised Stacks
The unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.
Our IGBT drivers are available as two- channel driver cores suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.
Achieve outstanding system compactness and create space- and cost-effective inverter designs with our drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.
More than 25 years of experience in developing innovative IGBT driver electronics enables Semikron Danfoss to have a short-term solution for almost every challenge related to driver electronics. Our Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with the adapter boards or application sample PCBs. For the latter, Semikron
Danfoss shares the entire manufacturing data to decrease development time, speeding up the time-to-market.
Our SKYPER and SKHI are well-known, highly robust and reliable IGBT driver solutions under demanding environmental conditions. Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable gate protection and reinforced insulation.
Our SKIC ASIC technology enables very compact system design with minimal peripheral components. With highly integrated signal processing and multi-channel failure management, our ASICs offer robust gate control
Driver boards, adapter Boards and Application Samples
Thermal Interface Materials
Stay Cool - Heat Dissipation is Our Job
Semikron Danfoss was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material (TIM). We now have over two decades of experience and more than 25 million pre-printed modules in the field.
We design print patterns for each module type for the best TIM distribution and thickness when the module is mounted to a heatsink. These patterns are printed on the modules in a clean environment on an automated silkscreen and stencil printing line. Statistical process control (SPC) is used to guarantee consistency. Special packaging is implemented to ensure that the TIM arrives at your production line in pristine condition.
In order to achieve the best thermal performance in all applications, Semikron Danfoss power modules can be supplied with our High Performance Thermal Paste (HPTP).
Alternatively, for ease-of-handling during assembly, most power modules are also available with pre-applied phase change material (PCM). Phase change materials have a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface. With HP-PCM, the new Semikron Danfoss-exclusive High Performance Phase Change Material, we combine the benefits of a phase change material with the performance of the best available paste.