Power Modules by Product Line

DCM™

The DCM power module technology platform is developed for traction applications to power up the fast-growing fleet of HECs, PHEVs, and BEVs. It is designed to be scalable. In the same package, the power can be scaled up or down to meet different inverter voltage classes with blocking voltages of 750V-1200V, while having different output currents from 350 to 900A. The DCM modules are based on quality components, patented packaging, and cooling technologies to achieve outstanding, measurable results in terms of reliable performance and robustness – all adding up to ensure a cost-effective solution that lasts. Certified processes assure consistent high quality and a streamlined path from development to volume manufacturing.

eMPack®

The eMPack power module platform is a frame-based power module designed for high power automotive applications. Available in 2-level or 3-level topologies it is suitable for mid power passenger vehicles or highly demanding commercial vehicle applications, covering a power range from 100kW up to 750kW. Inspired on this concept, eMPack M replicates the advantages in a smaller package, specifically tailored for mid to low power applications eMPack covers 400V and 800V battery system applications. The combination of silicon carbide technology with fully sintered, low stray inductance Direct Pressed Die Technology enables unmatched power densities combined with high reliability for automotive application.

MiniSKiiP®

The MiniSKiiP is the ultimate power module platform for motor drives, with a complete portfolio covering all drive power ratings using four module housings. A unique SKiiP Technology pressure system coupled with proven SPRiNG Technology contacts provides fast assembly, reliability, and serviceability.As opposed to conventional solder or press-fit modules requiring specialized equipment (automated presses, wave-soldering machines), no dedicated tools are needed for MiniSKiiP assembly. Instead, one or two screws connect everything from driver PCB to heatsink.The MiniSKiiP line is equipped with the latest IGBT chipsets from multiple suppliers, ensuring performance and supply chain safety.

Rectifier Bridges

Compact, low power bridge rectifiers are used as front ends for motor drives and power supplies. An entire single- or 3-phase bridge rectifier is integrated into a single housing. With blocking voltages up to 2200V, these rectifiers are useful for industrial line-fed applications. Packages are optimized for panel and heatsink mounting with one or two screws. Various terminal options are offered for PCB or wire connections.

SEMIPACK®

SEMIPACK is the industry standard bipolar module. With a well-established module outline and comprehensive range, the ideal solution can be found for any application. SEMIPACK modules are equipped with Semikron Danfoss diodes and thyristors in industry standard circuit configurations that can easily be built up into compact multi-phase rectifiers and converters.

SEMIPONT®

The SEMIPONT line of compact industrial rectifiers offers rectifier bridge and AC switch topologies in robust packages. Multiple terminal options are available for PCB, wire, and busbar mounting. The standard baseplate mounting is ideal for panel mounted rectifiers in electrical control cabinets, while a maximum blocking voltage of 1800V covers most line voltages.

SEMITOP® Classic

The SEMITOP Classic line offers a baseplate-less design with a 12 mm height for the low to medium power range. Mounting is accomplished via a single mounting screw and a PCB interface using solder or press-fit pins. Low commutation inductance and the use of the latest silicon and silicon carbide chip technologies make this product suitable for unique and complex circuit topologies with chip blocking voltages up to 1200V.

SEMITOP® E

The SEMITOP E line exceeds the standard for medium power modules with innovative packaging technology offering superior thermal performance. With two industry standard housings, low inductance, and a flexible pin matrix, the SEMITOP E is the perfect package for new designs requiring high performance silicon and silicon carbide chipsets.

SEMITRANS® 10

The SEMITRANS 10 line exceeds the standard for high power modules with multiple IGBT chip sources and a unique approach to 3-level converters. Robust industry standard housings are paired with multiple source IGBT chips and Semikron Danfoss CAL diodes to achieve power converters from 500kW up to multi-MW. The latest high current chipsets are fully utilized with a two-terminal design (SEMITRANS 10+). Powerful 3-level NPC and TNPC phase legs can be constructed using single modules (SEMITRANS 10 P3L) or two modules with the SEMITRANS 10 MLI approach.

SEMITRANS® 20

As the new high power standard in traction, renewables and drives, the SEMITRANS 20 represents the next generation of power modules for large converters. With a low-inductance internal design, the SEMITRANS 20 is easily paralleled, allowing for scalable platforms. This also allows for easy construction of high power 3-level ANPC converters. The SEMITRANS 20 product line features traction and industrial versions, each optimized for their respective power cycling requirements. With sintering technology, advanced baseplate, and substrate materials, the SEMITRANS 20 does not compromise when it comes to reliability.

SEMITRANS® Classic

The SEMITRANS Classic line represents the most well-established IGBT power module design in the industry. With a huge portfolio from 600V to 1700V, the SEMITRANS Classic covers robust high current IGBT chipsets as well as the latest fast switching types. Multiple source IGBTs, CAL diodes, and SiC MOSFETS are configured in half-bridge circuits and their variants for the design of medium power industrial converters. This product line features the well-known 62mm (SEMITRANS 3) and 34mm (SEMITRANS 2) IGBT modules that are at the core of many power converters. With decades of market experience, the SEMITRANS Classic packages deliver a proven design.

SEMiX® 1c

The SEMiX 1 is a compact baseplate-equipped module for low power motor drive applications. These power modules feature Converter-Inverter-Brake (CIB) topologies with integrated temperature sensors. Two-hole baseplate mounting and a 17mm height make this package easy to integrate into PCB-based designs.

SEMiX® 2c

The SEMiX 2 is an industry standard package for low power motor drive applications. These power modules feature rectifier, Converter-Inverter (CI), and Converter-Inverter-Brake (CIB) topologies with integrated temperature sensors in industry standard pinouts. Two-hole baseplate mounting and a 17mm height make this package easy to integrate into PCB-based designs.

SEMiX® 3 Press-Fit

The SEMIX 3 Press-fit is the industry standard medium power half-bridge module. With a standard four-hole mounting footprint and 17mm height, this module is commonplace across many industries in 2- and 3-level power converters. The SEMiX 3 Press-Fit features robust molded power terminals, press-fit pins for reliable solder-free driver connection and an option for shunt resistors for easy current monitoring.

SEMiX® 5

The SEMiX 5 is a five-terminal version of the popular 17mm high baseplate module, perfect for compact 2- and 3-level converters. Now an industry standard package, the SEMiX 5 boasts a spacious internal design that can package powerful 3-level phase legs with excellent thermal performance and low commutation inductance. This module also features robust molded power terminals and press-fit pins for reliable solder-free driver connection.

SEMiX® 6

With an industry standard pinout and footprint, the SEMiX 6 offers motor drive designers an array of topologies with the latest chipsets. The module is equipped with press-fit pins for reliable solder-free driver connection, a standard four-hole mounting footprint with baseplate and 17mm height.

SEMiX® Spring

The SEMiX Spring family is the original solution for solder-free driver mounting. SPRiNG Technology is used for auxiliary contacts, meaning driver boards can be installed and replaced easily. Screw power terminals are separated into AC and DC for easy parallelling. The portfolio features scalable half-bridge line-up in four package sizes with additional rectifier offerings, all in a standard 17mm height. An industry standard sixpack lineup is also available in a popular form factor.

SKiM® 4/5

SKiM 4 and SKiM 5 power modules implement sixpack and 3-level topologies in a compact footprint for medium power applications. SKiiP Technology gives a large space for solder-free mounting of a driver PCB. The pressure system also provides homogeneous mounting pressure, reducing thermal resistance and enabling more compact inverters than similar baseplate modules. Over two decades of field experience confirms the SKiM’s reliability and high load cycle capability.

SKiM® 93

SKiM 93 modules can significantly enhance the reliability of inverters, even under substantial active and passive temperature swings as well as demanding power cycle conditions. In addition to sintered chips, pressure contacts and spring technologies with AlCu-bonded diodes and high-performance thermal paste, the SKiM 93 module delivers up to 25% better performance for transient currents with the same chip set and the same lifetime as standard sinter modules. We also provide driver and adapter board solutions for rapid and customer-focused assessment.