SKiM® 4/5

SKiM 4 and SKiM 5 power modules implement sixpack and 3-level topologies in a compact footprint for medium power applications. SKiiP Technology gives a large space for solder-free mounting of a driver PCB. The pressure system also provides homogeneous mounting pressure, reducing thermal resistance and enabling more compact inverters than similar baseplate modules. Over two decades of field experience confirms the SKiM’s reliability and high load cycle capability.