SEMITOP® E
The SEMITOP E line exceeds the standard for medium power modules with innovative packaging technology offering superior thermal performance. With two industry standard housings, low inductance, and a flexible pin matrix, the SEMITOP E is the perfect package for new designs requiring high performance silicon and silicon carbide chipsets.
Features
- Baseplate-less
- Press-fit and solder terminals (power and auxiliary)
- Latest Si and SiC chipsets
- Half-bridge, buck, boost, CI, CIB, sixpack, h-bridge, chopper, and 3-level topologies
Applications
- Motor drives
- Solar and energy storage systems
- EV chargers
- UPS systems
- Green hydrogen
- Power supplies
Housings
- SEMITOP E1
- SEMITOP E2