Power Modules by Product Line

DCM™

The DCM power module technology platform is developed for traction applications to power up the fast-growing fleet of HEVs, PHEVs, and BEVs. It is designed to be scalable. In the same package, the power can be scaled up or down to meet different inverter voltage classes with blocking voltages of 750V-1200V, while having different output currents from 350 to 900A. The DCM modules are based on quality components, patented packaging, and cooling technologies to achieve outstanding, measurable results in terms of reliable performance and robustness – all adding up to ensure a cost-effective solution that lasts. Certified processes assure consistent high quality and a streamlined path from development to volume manufacturing.

eMPack®

The eMPack power module platform is a frame-based power module designed for high power automotive applications. Available in 2-level or 3-level topologies it is suitable for mid power passenger vehicles or highly demanding commercial vehicle applications, covering a power range from 100kW up to 750kW. Inspired on this concept, eMPack M replicates the advantages in a smaller package, specifically tailored for mid to low power applications eMPack covers 400V and 800V battery system applications. The combination of silicon carbide technology with fully sintered, low stray inductance Direct Pressed Die Technology enables unmatched power densities combined with high reliability for automotive application.

Rectifier Bridges

Compact, low power bridge rectifiers are used as front ends for motor drives and power supplies. An entire single- or 3-phase bridge rectifier is integrated into a single housing. With blocking voltages up to 2200V, these rectifiers are useful for industrial line-fed applications. Packages are optimized for panel and heatsink mounting with one or two screws. Various terminal options are offered for PCB or wire connections.

SEMIPACK®

SEMIPACK is the industry standard bipolar module. With a well-established module outline and comprehensive range, the ideal solution can be found for any application. SEMIPACK modules are equipped with Semikron Danfoss diodes and thyristors in industry standard circuit configurations that can easily be built up into compact multi-phase rectifiers and converters.

SEMIPONT®

The SEMIPONT line of compact industrial rectifiers offers rectifier bridge and AC switch topologies in robust packages. Multiple terminal options are available for PCB, wire, and busbar mounting. The standard baseplate mounting is ideal for panel mounted rectifiers in electrical control cabinets, while a maximum blocking voltage of 1800V covers most line voltages.

SEMITOP® Classic

The SEMITOP Classic line offers a baseplate-less design with a 12 mm height for the low to medium power range. Mounting is accomplished via a single mounting screw and a PCB interface using solder or press-fit pins. Low commutation inductance and the use of the latest silicon and silicon carbide chip technologies make this product suitable for unique and complex circuit topologies with chip blocking voltages up to 1200V.

SEMITRANS® 10

The SEMITRANS 10 line exceeds the standard for high power modules with multiple IGBT chip sources and a unique approach to 3-level converters. Robust industry standard housings are paired with multiple source IGBT chips and Semikron Danfoss CAL diodes to achieve power converters from 500kW up to multi-MW. The latest high current chipsets are fully utilized with a two-terminal design (SEMITRANS 10+). Powerful 3-level NPC and TNPC phase legs can be constructed using single modules (SEMITRANS 10 P3L) or two modules with the SEMITRANS 10 MLI approach.

SEMITRANS® 20

As the new high power standard in traction, renewables and drives, the SEMITRANS 20 represents the next generation of power modules for large converters. With a low-inductance internal design, the SEMITRANS 20 is easily paralleled, allowing for scalable platforms. This also allows for easy construction of high power 3-level ANPC converters. The SEMITRANS 20 product line features traction and industrial versions, each optimized for their respective power cycling requirements. With sintering technology, advanced baseplate, and substrate materials, the SEMITRANS 20 does not compromise when it comes to reliability.

SEMiX® 1c

The SEMiX 1 is a compact baseplate-equipped module for low power motor drive applications. These power modules feature Converter-Inverter-Brake (CIB) topologies with integrated temperature sensors. Two-hole baseplate mounting and a 17mm height make this package easy to integrate into PCB-based designs.

SEMiX® 2c

The SEMiX 2 is an industry standard package for low power motor drive applications. These power modules feature rectifier, Converter-Inverter (CI), and Converter-Inverter-Brake (CIB) topologies with integrated temperature sensors in industry standard pinouts. Two-hole baseplate mounting and a 17mm height make this package easy to integrate into PCB-based designs.

SEMiX® 3 Press-Fit

The SEMIX 3 Press-fit is the industry standard medium power half-bridge module. With a standard four-hole mounting footprint and 17mm height, this module is commonplace across many industries in 2- and 3-level power converters. The SEMiX 3 Press-Fit features robust molded power terminals, press-fit pins for reliable solder-free driver connection and an option for shunt resistors for easy current monitoring.

SEMiX® Spring

The SEMiX Spring family is the original solution for solder-free driver mounting. SPRiNG Technology is used for auxiliary contacts, meaning driver boards can be installed and replaced easily. Screw power terminals are separated into AC and DC for easy parallelling. The portfolio features scalable half-bridge line-up in four package sizes with additional rectifier offerings, all in a standard 17mm height. An industry standard sixpack lineup is also available in a popular form factor.