Motor Drives

Power Electronics for Motor Drives

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Performance Range

Since the first appearance of motor drives, Semikron Danfoss has been committed to supplying solutions for every power range. Almost 50 years ago, Semikron Danfoss introduced the first insulated power module: the SEMIPACK rectifier. Since then, other innovations for motor drives have been introduced, with the MiniSKiiP in particular revolutionizing the design of low and medium power systems.

Today, Semikron Danfoss offers the complete industry standard power module portfolio that serves a power range of 0.2kW to several megawatts.

With the latest generation of IGBTs and SiC MOSFETs from multiple suppliers, our power modules boost performance, power density, and effiency in motor drive applications.

The portfolio is completed with high power IPMs, power electronic stacks, and a comprehensive product line of driver electronics that help to reduce development effort and time-to-market.

Technology Highlights

Silicon Carbide MOSFETs for New Degrees of Freedom in Design

Compared to the latest generation Si IGBTS, the switching and conduction losses of SiC MOSFETs are considerably lower, thus offering designers new options for efficient drive platforms.

Increased power density allows for more compact drives or more power from given thermal designs. Faster switching with lower losses enables silent motor operation and smaller magnetics. Additionally, with SiC users can exploit new energy saving potentials. On a system level, this leads to a fast return on investment and reduced total cost of ownership. It also represents an important step towards more efficient energy utilization and decarbonization of the industry. Power modules with silicon carbide MOSFETs allow designers to push boundaries and re-think drives design.

With decades of experience in packaging power modules and supply chain reliabilty secured by strong, long-term partnerships with all top chip manufacturers, Semikron Danfoss is your ultimate partner for silicon carbide.

Silicon Carbide Features


Reliable Supply

The Ultimate Partner for Silicon Carbide Power Modules

RGA IGBT for True Multiple Sourcing

With the ROHM RGA IGBT, a newly designed 1200V, trench gate, light punch through IGBT, we introduce a powerful alternative to current Generation 7 IGBTs.

The RGA IGBT, which was developed with motor drives in mind, is widely compatible to latest Generation 7 IGBTs. Likewise, it can be continuously operated at Tj,max=150°C and intermittently at Tj,max=175°C. Gate voltages are identical and the gate charge is even lower, thus it can easily be driven by existing driver circuits.

The RGA also offers advantages when comparing it to market available Generation 7 IGBTs. The chip size is optimized so that the thermal resistance is lower and a power module with RGA IGBT runs cooler. This allows for an increase of power or a reduction in cooling. Additionally, while typical Generation 7 IGBTs desaturate at twofold nominal current, the RGA IGBT can handle threefold nominal current, thus offering higher peak current tolerance.

With the ROHM RGA IGBT packed into our MiniSKiiP and SEMITOP E industry standard housings, there is now a true alternative to Generation 7 IGBT power modules.

Optimized for Motor Drives


Compatible with Market Standards


Reliable Supply

MiniSKiiP products for motor drives in CIB and sixpack topologies
SEMITOP products for motor drives in CIB and sixpack topologies
True Multiple Sourcing with Semikron Danfoss Power Modules and ROHM IGBTs

Product Highlights

Full Scalability for PCB-Based Designs

With two decades of field experience and more than 60 million modules in the field, the MiniSKiiP platform has proven successful in all standard applications.

The unique mechanical design offers the simplest possible assembly. Heatsink, module and PCB connected with one or two screws in a single step, making solder or press-in processes and tools obsolete. In terms of sensivity to mechanical or thermal stress, the springs doing the electrical connection between PCB and power module have proven to be far superior to solder or press-fit joints.

With its wide power range, the MiniSKiiP product family provides a unique base for scalable PCB-based drive designs from 0.4kW up to 110kW. With a variety of topologies, it is the perfect match from single-axis drives to single PCB assemblies with multple axes.


One Consistent Mounting Concept for Drives up to 110kW

Easy One-Step Mounting

Benchmark Performance

More about MiniSKiiP

Flexibility for Compact Drives

The SEMITOP E product line design offers a range of alternative packages for compact PCB-based motor drives. With multiple sourcing down to the chip level, it provides the best supply chain safety.

The baseplate-less design offers superior thermal performance. This, combined with a low-inductance design, also makes SEMITOP E the perfect package for the latest Si and SiC chip technologies.

SEMITOP E modules are available with pre-applied High Performance Thermal Paste (HPTP). Alternatively, for ease-of-handling during assembly, it can also be supplied with pre-applied HP-PCM, the new Semikron Danfoss-exclusive High Performance Phase Change Material.


Full Flexibility for Compact Drives

Optimized Package

Superior Thermal Performance

More about SEMITOP

IGBT and Rectifier Module Family for Complete Motor Drive Solutions

SEMiX 3 Press-Fit features IGBT and rectifier modules in the same housing design for a complete medium/high power drive solution. As an industry standard power module available with the latest generation IGBT chips from different suppliers, it gives full supply chain safety.

It‘s your choice: SEMiX 3 Press-Fit is available with optional ...

... integrated current measurement shunts. The integration of the current measurement into the power module replaces expensive and bulky current sensors (i.e. Hall sensors). This reduces size and cost of the motor drive system.

... Plug-and-Play driver SKYPER 12 Press-Fit. Simply pressed onto the power module’s press-fit pins, the driver reduces time-to-market thanks to a ready-to-go solution.

... pre-applied phase change material HP-PCM. Combines the benefits of a phase change material with the performance of the best thermal paste.


Industry Standard Package with Optional:

Available as a Complete 17mm-High Solution


The Latest Generation 7 IGBT

25% higher output power thanks to the latest Generation 7 IGBT

More about SEMiX 3 Press-Fit
MiniSKiiP: Scalable without compromise – Power Electronics for Motor Drives

Product Portfolio

Power Modules



0.4kW to 110kW
Solder-free spring technology for minimum assembly time


0.4kW to 55kW
Exceeding the standard for superior performance


800V to 2200V
Bipolar modules from the market leader

SEMiX® 1/2/6 Solder

1.5kW to 45kW
Industry Standard for Low Power Drives

SEMiX® 6 Press-Fit

15kW to 75kW
The complete press-fit standard

SEMiX® 3 Press-Fit

55kW to 350kW
Exceeding the standard for superior performance


25kW up to 500kW
The proven power electronics packages


150kW to 1100kW
Power Modules for Ulta-Compact Soft-Starters


110kW to 200kW
Medium Power Standard


600kW to 1MW
Robust high power modules


500kW to 1MW
The new standard in high power
Semikron Danfoss Image Motor Drives

Intelligent Power Modules – IPMs

For Maximum Reliability


The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air and water cooling, also with customized heatsinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.

SKiiP 3 has propagated widely through the industrial drive segment. With its sixpack or half-bridge topologies, it covers a current range from 500A up to 2400A.

The SKiiP 4, available in half-bridge topology, has been optimized for highest power cycling requirements and covers the higher power range up to 3600A.

To ensure highest reliability and service life, the power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layer, which usually causes the limitation in lifetime.

Hence, sintering improves power and thermal cycling capability. The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.

High Performance Cooling (HPC) technology has been introduced providing approximately 25% more output capability compared to standard water cooling. A double side mounting HPC water cooler is also available and enables an even higher power density.

Key Features

More about SKiiP

Power Electronic Stack Platforms

Fully Qualified Inverter Assemblies Tailored to Your Specific Needs

Standard Stacks

Our Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from 380V to 690V. Our standard stacks cover an output current range from 70A to 4000A.

More about Power Electronic Stacks

Customized Stacks

In addition to standard stacks, Semikron Danfoss has vast experience in developing customer-specific solutions. Engineers are available in our stack centers around the globe to offer specific solutions by adapting existing platforms or designing customized converters.

Four Key Factors for your success

More about Customized Stacks
Semikron Danfoss Image Driver

Product Portfolio

IGBT Driver

The unique product portfolio enables access to all established industries with a one-stop solution that combines state-of-the-art power modules and driver electronics.

Our IGBT drivers are available as two- channel driver cores suitable for any standard semiconductor power module or as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit, SEMITRANS 10 and compatible modules.

Cost Efficient

Achieve outstanding system compactness and create space- and cost-effective inverter designs with our drivers, utilizing highly integrated ASIC technology. Isolated DC-link voltage and temperature sensor signals at the driver’s interface along with over-voltage and over-temperature lockout also help to reduce system costs significantly.

Time Efficient

More than 25 years of experience in developing innovative IGBT driver electronics enables Semikron Danfoss to have a short-term solution for almost every challenge related to driver electronics. Our Plug-and-Play drivers connect directly to most common standard IGBT modules. The IGBT driver cores fit with the adapter boards or application sample PCBs. For the latter, Semikron Danfoss shares the entire manufacturing data to decrease development time, speeding up the time-to-market.


Our SKYPER and SKHI are well-known, highly robust and reliable IGBT driver solutions under demanding environmental conditions. Over many years of field operation experience the proprietary IGBT driver technology has been relentlessly developed further. This technology sets new standards for the essential features of safe gate control, reliable gate protection and reinforced insulation.

Compact Design

Our SKIC ASIC technology enables very compact system design with minimal peripheral components. With highly integrated signal processing and multi-channel failure management, our ASICs offer robust gate control.

Key Factors

Driver Cores

Plug-and-Play Driver

Adapter Board and Application Samples

Semikron Danfoss Image Thermal Interface Materials

Thermal Interface Materials

Stay Cool – Heat Dissipation is Our Job


Semikron Danfoss was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material (TIM). We now have over two decades of experience and more than 25 million pre-printed modules in the field.

We design print patterns for each module type for the best TIM distribution and thickness when the module is mounted to a heatsink. These patterns are printed on the modules in a clean environment on an automated silkscreen and stencil printing line. Statistical process control (SPC) is used to guarantee consistency. Special packaging is implemented to ensure that the TIM arrives at your production line in pristine condition.

In order to achieve the best thermal performance in all applications, Semikron Danfoss power modules can be supplied with our High Performance Thermal Paste (HPTP).

Alternatively, for ease-of-handling during assembly, most power modules are also available with pre-applied phase change material (PCM). Phase change materials have a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal in- terface. With HP-PCM, the new Semikron Danfoss-exclusive High Performance Phase Change Material, we combine the benefits of a phase change material with the performance of the best available paste.

Key Features


More about Thermal Interface Materials

Further Information