PCIM Expo & Conference 2026
From June 9–11, 2026, Nuremberg will once again become the global hub for power electronics as PCIM Expo & Conference opens its doors to industry leaders, innovators, and experts from around the world.
Semikron Danfoss is proud to be part of it. Visit us at booth 7-459 to explore our latest product innovations and discover how we’re shaping the future of power electronics. We look forward to meeting you in person and sharing our vision for a smarter, more sustainable world.
PCIM Expo Highlights
With our innovative solutions for e-mobility, industrial and renewable applications we help the world utilize energy more efficiently and sustainable and thus to significantly reduce overall CO2 emissions – one of the biggest challenges the world faces today. Here is a first look at some of the highlights we will be showing at PCIM Expo 2026.
Power Electronics for Data Centers
With a strong history of delivering reliable power modules for UPS systems, we are ready for the next evolution of the data center ecosystem.
Today, both small and large data centers rely on Semikron Danfoss power modules inside UPS systems and motor drives for reliable power transfer and cooling. Power modules such as SEMITRANS 3 and SEMiX 5 are core components in 3-level converters used for today’s megawatt-class central UPS systems.
A new generation of freewheeling diodes
CAL7 combines Semikron Danfoss’s Controlled Axial Lifetime diode concept with thin wafer technology to improve switching behavior, reduce overvoltage and EMI, and increase power density. Designed for optimal performance with modern IGBT chips in high-power modules.
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SKiiP 4 SiC – IPM with 2kV SiC MOSFETs
Bring high‑power SiC converters to market faster with SkiiP4 SiC – the pre-qualified building block integrating power modules, gate drivers, sensors and cooling. Optimized SiC performance with proven reliability for applications from 600V-1500VDC and from 500kW to multi-megawatt systems.
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Improved Reliability for Renewable Applications
Power converters for wind, solar, and energy storage continue to push the limits of power density and reliability. Semikron Danfoss is expanding its portfolio with advanced packaging technologies and devices designed to support these requirements.
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New Multi-Sourcing Option for IGBTs
Our power modules are available with the latest CRRC IGBT chips, offering blocking voltages of 1200V, 1700V, and 2300V, a maximum operating junction temperature of 175°C, and low conduction and switching losses.
Power Electronic Stacks
Focus on your core innovation while we handle the complexity of high-power conversion. Ready-to-integrate stacks up to multi-megawatt range accelerate your path from concept to production. Leverage proven SiC expertise and global support to boost performance, simplify your supply chain, and cut time-to-market by years.
Stage Presentations & Conference Contributions
Join us in Nuremberg for a series of expert-led presentations showcasing our latest innovations in silicon carbide (SiC) technologies, advanced packaging solutions, high-power system design, and reliability enhancements.
Our specialists will share insights into optimizing megawatt-scale renewable energy systems, modeling next-generation MOSFET performance, leveraging intelligent simulation platforms for SiC power modules, developing low-inductive high-power packages, and improving PCB robustness. These sessions offer a unique opportunity to learn from industry leaders driving efficiency, performance, and sustainability across diverse applications.