IGBT and rectifier module family for solder-free mounting
SEMiX® Spring Benefits
The SEMiX Spring simplify inverter design and production, using the same height (17mm) and principal DC-link design across the family.
Compact, state-of-the-art inverter construction is possible thanks to the slim package and separated AC and DC terminals. Gate drivers mount directly to the top of the SEMiX module, saving development time and allowing a simple, low inductance DC-link.
Spring contacts allow fast and easy production, optimized through uniform direction of assembly, reducing manufacturing costs. Auxiliary contacts avoid solder joints, instead using highly reliable spring contacts, offering increased reliability and lifetime.
SEMiX® Spring Key Features
- IGBT modules available in 600V, 1200V and 1700V from 75A to 600A
- Multiple IGBT chip sources
- Half-bridge. sixpack and chopper topologies
- Solder-free contacts for highest durability
- Family concept with IGBT modules and rectifier modules
SEMiX® Spring Applications
This flexible, application-oriented power module contains the latest chip technology optimized for motor drives, switching power supplies and current source inverters. Additional applications include uninterruptible power supplies, photovoltaic systems and wind energy.
SEMiX® Spring Product Range
Six different housing sizes are available in 600V, 1200V and 1700V for the IGBT modules. Half-bridge, pack and chopper topologies are available from 75A to 600A. In addition to IGBT3 and IGBT4 chips, the 1200V range also includes a V-IGBT series. Controlled, half-controlled and uncontrolled rectifier modules with identical footprint and 17mm height are also available.