SEMiX® 3 Press-Fit
For solder-free mounting with press-fit gate contacts
SEMiX® 3 Press-Fit Benefits
The concept of SEMiX 3p is a 17mm height module. Press-fit contacts allow a gate driver to mount directly on top of the module. Therefore, there is no risk of noise on wires or loose connectors. Compact, state-of-the-art inverter construction is possible thanks to the slim package and separated AC and DC screw terminals.
Auxiliary contacts avoid solder joints, instead using highly reliable press-fit contacts. This leads to increased product reliability and lifetime. Press-fit contacts allow fast and easy production, optimized through uniform direction of assembly, reducing manufacturing costs.
Select SEMiX 3p modules have optional built-in shunt resistor for measuring the AC current, accessible via press-fit pins. This allows the footprint and main connections to remain identical to the standard module, while eliminating the need for current sensors. Integrating the current monitoring into the power module reduces inverter volume and decreases system costs. Additionally, reducing components in the inverter enhances the FIT rate.
SEMiX® 3 Press-Fit Key Features
- From 225A to 700A, in 650V, 1200V and 1700V
- Half-bridge, chopper, 3-level and common emitter topologies
- Hybrid Silicon Carbide for reduced switching losses
- Latest Generation 7 IGBTs
- Integrated current-sensing shunt resistor in select types
- Direct driver assembly
- Versatile connection concept
- Solder-free contacts for highest durability
SEMiX® 3 Press-Fit Applications
The SEMiX 3p is a flexible and application-oriented module. These IGBT modules have the latest chip technologies optimized for motor drives, switching power supplies, uninterruptible power supplies, photovoltaic systems and wind energy.
SEMiX® 3 Press-Fit Product Range
IGBT Half-bridge, chopper, 3-level and common emitter modules in 1200V and 1700V are available in the SEMiX 3p package with optional shunt resistors for select half-bridges.