24922910VM05
SK50DGDL12T7ETE2s-M05
SEMITOP E2 Solder, HPTP
24922910VM05
Product specifications
Characteristic | Value |
|---|---|
| Product Status | In Production New |
| Country of origin | Italy |
| Current (A) | 50 A |
| Voltage (V) | 1200 V |
| Topology | CIB |
| Product line | SEMITOP |
| Housing | SEMITOP E2 Solder |
| Dimensions (LxWxH) | 63x57x12 |
| Technology | IGBT |
| Chip technology | IGBT T7 |
| Features | Optimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532 |
| Typical applications | Motor drivesAir conditioningAuxiliary Inverters |
| Variant | HPTP |
| Variant Description | The SK50DGDL12T7ETE2s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + High Performance Thermal Paste (HPTP) |
| Variants | <a href="/products/p/sk50dgdl12t7ete2s-m05-24922910vm05">SK50DGDL12T7ETE2s-M05</a><a href="/products/p/sk50dgdl12t7ete2s-m07-24922910vm07">SK50DGDL12T7ETE2s-M07</a><a href="/products/p/sk50dgdl12t7ete2s-24922910">SK50DGDL12T7ETE2s</a> |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.055 Kilogram |
| Net weight | 0.035 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |