24919631VM05
SK25GD12T4ETp-M05
SEMITOP 3 Press-Fit, HPTP
24919631VM05
Product specifications
Characteristic | Value |
|---|---|
| Chip technology | IGBT 4 (Trench) |
| Country of origin | Italy |
| Current (A) | 25 A |
| Dimensions (LxWxH) | 31x55x12 |
| Features | One screw mounting moduleOptimized design for superior thermal performancesLow inductive designCompatible with other SEMITOP<sup>®</sup> Press-Fit types1200V Trench IGBT (T4)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized, file no. E 63 532 |
| Housing | SEMITOP 3 Press-Fit |
| Product line | SEMITOP |
| Product Status | In Production New |
| Technology | IGBT |
| Topology | Sixpack |
| Type | SEMITOP 3 Press-Fit |
| Typical applications | Motor DrivesServo DrivesAir ConditioningAuxiliary InvertersUPS |
| Variant | HPTP |
| Variant Description | The SK25GD12T4ETp-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + High Performance Thermal Paste (HPTP) |
| Voltage (V) | 1200 V |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.035 Kilogram |
| Net weight | 0.026 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |