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24919631VM05

SK25GD12T4ETp-M05

SEMITOP 3 Press-Fit, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originItaly
Current (A)25 A
Voltage (V)1200 V
TopologySixpack
Product lineSEMITOP
HousingSEMITOP 3 Press-Fit
Dimensions (LxWxH)31x55x12
TechnologyIGBT
Chip technologyIGBT 4 (Trench)
FeaturesOne screw mounting moduleOptimized design for superior thermal performancesLow inductive designCompatible with other SEMITOP<sup>®</sup> Press-Fit types1200V Trench IGBT (T4)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized, file no. E 63 532
Typical applicationsMotor DrivesServo DrivesAir ConditioningAuxiliary InvertersUPS
VariantHPTP
Variant DescriptionThe SK25GD12T4ETp-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk25gd12t4etp-m05-24919631vm05">SK25GD12T4ETp-M05</a><a href="/products/p/sk25gd12t4etp-24919631">SK25GD12T4ETp</a>

General specifications

Characteristic
Value
Gross weight0.035 Kilogram
Net weight0.026 Kilogram
Proposition 65Cancer and Reproductive Harm