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24923210VM05

SK10DGD12T7ETE1s-M05

SEMITOP E1 Solder, HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT T7
Country of originItaly
Current (A)10 A
Dimensions (LxWxH)63x34x12
HousingSEMITOP E1 Solder
Product lineSEMITOP
Product StatusIn Production New
TechnologyIGBT
TopologyCI
Typical applicationsMotor drivesAir conditioningAuxiliary Inverters
VariantHPTP
Variant DescriptionThe SK10DGD12T7ETE1s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.022 Kilogram
Net weight0.022 Kilogram
Proposition 65Cancer and Reproductive Harm