Semikron Danfoss logo

24923210VM05

SK10DGD12T7ETE1s-M05

SEMITOP E1 Solder, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originItaly
Current (A)10 A
Voltage (V)1200 V
TopologyCI
Product lineSEMITOP
HousingSEMITOP E1 Solder
Dimensions (LxWxH)63x34x12
TechnologyIGBT
Chip technologyIGBT T7
Typical applicationsMotor drivesAir conditioningAuxiliary Inverters
VariantHPTP
Variant DescriptionThe SK10DGD12T7ETE1s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk10dgd12t7ete1s-m05-24923210vm05">SK10DGD12T7ETE1s-M05</a><a href="/products/p/sk10dgd12t7ete1s-m07-24923210vm07">SK10DGD12T7ETE1s-M07</a><a href="/products/p/sk10dgd12t7ete1s-24923210">SK10DGD12T7ETE1s</a>

General specifications

Characteristic
Value
Gross weight0.022 Kilogram
Net weight0.022 Kilogram
Proposition 65Cancer and Reproductive Harm