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24920390VM05

SK 75 GHL 07F3TD1-M05

SEMITOP 3, HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 3 (Trench)
Country of originItaly
Current (A)75 A
Dimensions (LxWxH)55x31x12
FeaturesCompact designOne screw mounting moduleOptimum heat transfer and insulation through direct copper bonding aluminum oxide ceramic (DBC)650V Trench3 Fast IGBT technology650V Rapid switching diodeIntegrated NTC temperature sensorUL recognized, file no. E 63 532
HousingSEMITOP 3
Product lineSEMITOP
Product StatusIn Production New
TechnologyIGBT
TopologyH-Bridge
Typical applicationsInverterWeldingUPS
VariantHPTP
Variant DescriptionThe SK 75 GHL 07F3TD1-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Voltage (V)650 V

General specifications

Characteristic
Value
Gross weight0.039 Kilogram
Net weight0.03 Kilogram
Proposition 65Cancer and Reproductive Harm