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27895001VM07

SEMiX603GB12E4pV1-M07

SEMiX 3p, HP-PCM

Product specifications

Characteristic
Value
Chip technologyIGBT 4 (Trench)
Country of originSlovakia
Current (A)600 A
Dimensions (LxWxH)150x62x17
FeaturesHomogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityPress-fit pins as auxiliary contactsThermally optimized ceramicUL recognized, file no. E63532
HousingSEMiX 3p
Product lineSEMiX
Product StatusIn Production New
TechnologyIGBT
TopologyHalf-Bridge
TypeSEMiX 3p
Typical applicationsAC inverter drivesUPSRenewable energy systems
VariantHP-PCM
Variant DescriptionThe SEMiX603GB12E4pV1-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a silicone-free phase change material (PCM) having a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface.
Variant Short DescriptionModule + High Performance Phase Change Material (HP-PCM)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.381 Kilogram
Net weight0.35 Kilogram
Proposition 65Cancer and Reproductive Harm