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27890120VM05

SEMiX302GB12E4s-M05

SEMiX 2s, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production
Country of originSlovakia
Current (A)300 A
Voltage (V)1200 V
TopologyHalf-Bridge
Product lineSEMiX
HousingSEMiX 2s
Dimensions (LxWxH)117x64x17
TechnologyIGBT
Chip technologyIGBT 4 (Trench)
FeaturesHomogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityUL recognized, file no. E63532
Typical applicationsMotor DrivesPower SupplyMatrix Converter
VariantHPTP
Variant DescriptionThe SEMiX302GB12E4s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/semix302gb12e4s-m04-27890120vm04">SEMiX302GB12E4s-M04</a><a href="/products/p/semix302gb12e4s-m05-27890120vm05">SEMiX302GB12E4s-M05</a><a href="/products/p/semix302gb12e4s-m06-27890120vm06">SEMiX302GB12E4s-M06</a><a href="/products/p/semix302gb12e4s-m07-27890120vm07">SEMiX302GB12E4s-M07</a><a href="/products/p/semix302gb12e4s-27890120">SEMiX302GB12E4s</a>

General specifications

Characteristic
Value
Gross weight0.279 Kilogram
Net weight0.24 Kilogram