Semikron Danfoss logo

27890120VM05

SEMiX302GB12E4s-M05

SEMiX 2s, HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 4 (Trench)
Country of originSlovakia
Current (A)300 A
Dimensions (LxWxH)117x64x17
FeaturesHomogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityUL recognized, file no. E63532
HousingSEMiX 2s
Product lineSEMiX
Product StatusIn Production
TechnologyIGBT
TopologyHalf-Bridge
Typical applicationsMotor DrivesPower SupplyMatrix Converter
VariantHPTP
Variant DescriptionThe SEMiX302GB12E4s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.279 Kilogram
Net weight0.24 Kilogram