22894260VM05
SKM800GB12M7-M05
SEMITRANS 3, HPTP
22894260VM05
Product specifications
Characteristic | Value |
|---|---|
| Chip technology | IGBT M7 |
| Country of origin | Slovakia |
| Current (A) | 800 A |
| Dimensions (LxWxH) | 106x62x31 |
| Features | V<sub>CE(sat)</sub> with positive temperature coefficientFast and soft switching inverse CAL7 diodesHigh overload capabilityLow loss high density IGBT´sLarge clearance (10 mm) and creepage distances (20 mm)Insulated copper baseplate using DBC Technology (Direct Bonded Copper)UL recognized, file no. E63532 |
| Housing | SEMITRANS 3 |
| Product line | SEMITRANS |
| Product Status | In Production New |
| Technology | IGBT |
| Topology | Half-Bridge |
| Type | SEMITRANS 3 |
| Typical applications | AC inverter drivesUPSSolar energyEnergy storage |
| Variant | HPTP |
| Variant Description | The SKM800GB12M7-M05 is a 1200 V IGBT module and comes with a pre-applied 2.8mm height slim pressure lid and High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content. |
| Variant Short Description | Module + High Performance Thermal Paste (HPTP) |
| Voltage (V) | 1200 V |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.32 Kilogram |
| Net weight | 0.31 Kilogram |